Thermal Analysis Of 3D Stacking And BEOL Technologies
Low Power-High Performance SPONSOR BLOG The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack. Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology … Read more